JPH0361331U - - Google Patents
Info
- Publication number
- JPH0361331U JPH0361331U JP12274389U JP12274389U JPH0361331U JP H0361331 U JPH0361331 U JP H0361331U JP 12274389 U JP12274389 U JP 12274389U JP 12274389 U JP12274389 U JP 12274389U JP H0361331 U JPH0361331 U JP H0361331U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- bonded
- substrate
- substrate according
- grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12274389U JPH0361331U (en]) | 1989-10-19 | 1989-10-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12274389U JPH0361331U (en]) | 1989-10-19 | 1989-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361331U true JPH0361331U (en]) | 1991-06-17 |
Family
ID=31670736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12274389U Pending JPH0361331U (en]) | 1989-10-19 | 1989-10-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361331U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008233473A (ja) * | 2007-03-20 | 2008-10-02 | Ntt Electornics Corp | 薄膜基板の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121715A (ja) * | 1983-12-06 | 1985-06-29 | Toshiba Corp | 半導体ウエハの接合方法 |
| JPS61144839A (ja) * | 1984-12-18 | 1986-07-02 | Toshiba Corp | 半導体ウエハの接着方法 |
| JPS62101031A (ja) * | 1985-10-28 | 1987-05-11 | Nec Corp | 集積回路 |
-
1989
- 1989-10-19 JP JP12274389U patent/JPH0361331U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121715A (ja) * | 1983-12-06 | 1985-06-29 | Toshiba Corp | 半導体ウエハの接合方法 |
| JPS61144839A (ja) * | 1984-12-18 | 1986-07-02 | Toshiba Corp | 半導体ウエハの接着方法 |
| JPS62101031A (ja) * | 1985-10-28 | 1987-05-11 | Nec Corp | 集積回路 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008233473A (ja) * | 2007-03-20 | 2008-10-02 | Ntt Electornics Corp | 薄膜基板の製造方法 |